Multicore Wire, 0.7mm Lead solder, 183 → 188°C Melting Point

Product image for MULTICORE CRYSTAL 511 SOLDER,0.71MM,500G

Multicore Crystal™ No-Clean Flux

A careful balance of resins and activators provides clear residues without the need for cleaning in most applications.

Crystal™ 400 is halide-free and is suitable for soldering copper, brass and nickel (RS 229-4263)
Crystal™ 511 is suitable for badly oxidised surfaces and materials with inherently poor solderability (RS 229-4308)

Multicore Wire, 0.7mm Lead solder, 183 → 188°C Melting Point

Product image for 60/40 TIN/LEAD SOLDER X39,0.7MM,500G

60//40 Tin/Lead Solder X39

Very low residue no clean flux for good quality components / PCBs.

2 cores

Multicore Wire, 1.2mm Lead solder, 183 → 188°C Melting Point

Product image for 60/40 TIN/LEAD SOLDER X39,1.2MM,250G

60//40 Tin/Lead Solder X39

Very low residue no clean flux for good quality components / PCBs.

2 cores

Multicore Wire, 0.5mm Lead solder, 183 → 188°C Melting Point

Product image for 60/40 TIN/LEAD SOLDER 0.5MM,250G

60/40 Tin-Lead Solder

Tin lead solder, also known as soft solder, is an alloy suitable for high-quality work by professionals to repair or rework intermetallic bonds that require a low melting temperature. This solder wire enables you to achieve superior strength and thermal resistance. The flux properties in this product, are made from high-quality materials that are reliable and easy to use. Making it ideal for use by professionals for common electrical soldering.

Features & Benefits

5 cores of Ersin® flux
Excellent Joint Strength
Easy to use

Product Application Information

Used for soldering in various areas of the electronics industry.

Multicore Wire, 0.56mm Lead solder, 179°C Melting Point

Product image for LOCTITE 362 SN62 5C 0.56MM SOLDER 250G

Low Melting Point (L.M.P.) Solder

A tin/lead solder which exhibits a very sharp (eutectic) melting transition and is ideal for repairs on fabricated boards.

Thermal damage to components can be minimised due to lower temperatures
5 cores of Ersin® flux

Multicore Wire, 0.46mm Lead solder, 183 → 188°C Melting Point

Product image for MULTICORE CRYSTAL 511 SOLDER,0.50MM

Multicore Crystal™ No-Clean Flux

A careful balance of resins and activators provides clear residues without the need for cleaning in most applications.

Crystal™ 400 is halide-free and is suitable for soldering copper, brass and nickel (RS 229-4263)
Crystal™ 511 is suitable for badly oxidised surfaces and materials with inherently poor solderability (RS 229-4308)

Multicore Wire, 0.46mm Lead solder, 183 → 188°C Melting Point

Product image for CRYSTAL 400 SOLDER 0.5MM,250G

Multicore Crystal™ No-Clean Flux

A careful balance of resins and activators provides clear residues without the need for cleaning in most applications.

Crystal™ 400 is halide-free and is suitable for soldering copper, brass and nickel (RS 229-4263)
Crystal™ 511 is suitable for badly oxidised surfaces and materials with inherently poor solderability (RS 229-4308)

Multicore Wire, 0.7mm Lead solder, 183 → 188°C Melting Point

Product image for COLOPHONY ROSIN FREE SOLDER,0.7MM,500G

Rosin-Free 60//40 Tin/Lead Solder

Rosin-free solder for fast and sustained soldering on copper and brass.

5 Cores of Ecosol® 105 Rosin (Colophony) free flux
Similar performance to traditional solders
High activity – no dewetting
Approximate melting point of solder: 183-188°C

Multicore Wire, 0.7mm Lead solder, 183°C Melting Point

Product image for COLOPHONY ROSIN FREE SOLDER,0.7MM,250G

Rosin-Free 60//40 Tin/Lead Solder

Rosin-free solder for fast and sustained soldering on copper and brass.

5 Cores of Ecosol® 105 Rosin (Colophony) free flux
Similar performance to traditional solders
High activity – no dewetting
Approximate melting point of solder: 183-188°C

Multicore Wire, 0.7mm Lead solder, 183 → 188°C Melting Point

Product image for MULTICORE CRYSTAL 511 SOLDER,0.71MM,250G

Multicore Crystal™ No-Clean Flux

A careful balance of resins and activators provides clear residues without the need for cleaning in most applications.

Crystal™ 400 is halide-free and is suitable for soldering copper, brass and nickel (RS 229-4263)
Crystal™ 511 is suitable for badly oxidised surfaces and materials with inherently poor solderability (RS 229-4308)

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